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In principle, deposit soldering/brazing is a process variant which can be classified as high-temperature brazing (>450 °C) and low temperature soldering (<450 °C). Both are thermal processes which are carried out either without flux in a vacuum or under inert gas. Moreover, ultrasonic energy can be used to metallize surfaces e.g. ceramics, light metals or glasses at temperatures lower than 450 °C without the need of flux. The special feature of deposit soldering/brazing is that no components are permanently joined together, but a metallic layer is created by applying solderable materials.
The brazing materials most commonly used in high-temperature brazing are nickel, cobalt, iron and copper-based solders or corresponding alloys. Depending on the coating function, brazing/soldering materials with different morpholgies and concentrations can be added. Carbides, borides, silicides, diamonds, oxides, CBn or hard material mixtures can be used as hard materials. Well-established hard materials are WC, CrC or NbC.